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Electronic Assembly

Manufacturing Overview

  • Dynamic Manufacturing Resource Planning (MRP System)
  • Partnership with SMT facility (fine pitch, 0201, etc.)
  • Dedicated Cellular Manufacturing Lines
  • Lean Manufacturing
  • Successive Inspection
  • Automated Processes
  • Statistical Process Controls
  • Yield Tracking Databases
  • Operator/Inspector Training Programs
  • ESD Control Program per EIA-625
  • Controlled Documentation

Processes and Materials

Substrates:

  • Thick Film Ceramic (Al2O3 & BeO)
  • Direct Bond Copper (Al2O3 & BeO)
  • Thin Film
  • LTCC/HTCC Ceramic
  • Laminate and Flex

Component Attach:

  • Epoxy
  • Solder
  • Flip Chip, µBGA & QFP
  • Eutectic
  • Fluxless Soft-Solder

Packaging:

  • Hermetic
  • Epoxy Die Coat (COB)
  • Encapsulated
  • Lead Frame
  • Solder Ball Bumping
  • 3-D Assembly

Wire Bond:

  • Gold Ball (0.7 to 2.0-mil)
  • Aluminum Wedge (0.7 to 2.0-mil)
  • Aluminum Heavy Wire (5 to 20-mil)

Hermetic Hybrid Technology

Hermetic Package Sealing

  • MIL-PRF-38534 Class H and K
  • Parallel Seam Welding
  • Vacuum Furnace (DAP)
    • Solder Sealing
    • Fluxless Component Attach
    • Hydrogen Forming Gas
  • Inert Gas Sealing Environment
  • Fine/Gross Leak Testing
  • Nitrogen Bake
  • Vacuum Bake

Multi-chip Modules

  • Ceramic Substrates
  • Epoxy Component Attach
  • Gold Ball and Heavy Wire Bonding

Advanced Packaging Technology

  • Laminate Substrates
  • Mixed Technology - COB & SMT
  • RF, Signal Processing and Power Circuits
  • 0201 and 0402 SMT Components
  • Bare IC and Stacked IC
  • Firmware Programming
  • Die Coat (COB)
  • 3D Assembly of Batteries and Other Components
  • Micro Hand-Soldering
  • In-Process and Final Testing
  • Chip-On-Flex
  • Multichip Modules
  • Chip Stacking
  • Flip Chip & CSP Placement
  • Gold-Stud Bumping
  • Solder Ball Bumping
  • High-Density Optimization - SMT/CSP/µBGA/C

Power Hybrid Technology

  • MIL-PRF-38534 Class H and K
  • BeO and Direct-Bond-Copper Substrates
  • Solder and Eutectic Component Attach
  • 5-mil to 20-mil Aluminum Wire Bonding
  • Hermetic and Encapsulation Packaging
  • Testing (specific to power modules)

Automated Processes

Bare Die Attach

  • MRSI 505 Work Cell
  • Used to place bare ICs out of waffle/gel packs
  • Options included:
    • Eutectic Die Attach
    • Rotary Flux Well
    • Tape Feeders
    • Hi-Res. Flip Chip Camera

Fluid Dispense

  • Asymtek C-720 Fluid Dispenser
  • Used for Epoxy/Flux/Solder Dispensing
  • Options:
    • Heated Vacuum Stage
    • Dual Head Design
    • Rotary Auger Valve
    • Positive Displacement Valve for Flip Chip Underfill
    • Closed Loop Measurement for Fluid Viscosity

Wire Bond

  • Palomar 2470 Wedge Bonder
  • Palomar 2460-5 Gold Ball Bonder
  • Used for Fine-Pitch Wire Bonding on Bare ICs
  • Options:
    • Custom Wire-Loop Configuration
    • Deep Cavity Access
  
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